Panel: Cooling Challenges in an AI & Supercomputing World: Strategies for Sustaining High-Performance Computing Systems
As the demands for computational power escalate in the era of AI and supercomputing, the associated heat dissipation challenges become more pronounced. This panel will delve into the intricate world of cooling strategies designed to sustain optimal performance in AI and supercomputing environments. Experts from diverse fields, including hardware design, cooling technologies, and system architecture, will discuss innovative cooling solutions, liquid cooling advancements, and the integration of AI-driven thermal management. Join us for a comprehensive exploration of how we can keep it cool in the face of escalating computing power demands, ensuring the longevity and efficiency of AI and supercomputing systems.