Chief Commercial Officer
Smart High Tech AB
Thermal management in the electronics industry has for years become a limiting factor in designing
faster and more powerful electronics. Traditional thermal interface materials such as thermal paste,
grease and soft metals suffer from problems such as pump out, plastic deformation, dry out, and
insufficient thermal conductivity to handle power spikes. The novel graphene enhanced thermal
interface material solves all these issues and promises a continued development where thermal
conductivity between cold plate and application is efficient, soft, elastic, and lasts for a long term.
Graphene enhanced thermal interface materials for electronics cooling applications
Graphene, due to its exceptional mechanical, optical, electrical, physical and thermal properties, has attracted strong interest for both fundamental studies and real applications. Among all these properties, the extraordinary high thermal conductivity makes graphene an ideal cooling material for power devices and systems. In mean time, the rapid growth of information technology continues to increase power density and integration levels in electronics devices, leading to an increase in greater heat dissipation, lower performance, and shorter operating life.
In this talk, the experimental results and potential applications scenario are given. It is shown that this kind of new class thermal interface material can be used for many large power and high density cooling applications.