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The Speakers

Andy Delano

Principal Mechanical Engineer 


Andy leads the Microsoft Surface team’s thermal architectural and technology efforts. Prior to joining Microsoft in 2012, Andy managed the thermal R&D team within Honeywell’s electronic materials division developing launching highly successful products for the electronics packaging industry. Andy started his career in 1998 as a thermal engineer at Hewlett-Packard designing server and workstation thermal systems. While at HP, Andy was also an adjunct professor at CU and taught heat transfer, thermodynamics, and thermal systems design between 1999 and 2005.

Dr. Karla Reyes

Principal Member of Technical Staff,
Materials Chemistry Department
Sandia National Laboratories

Dr. Karla Reyes currently works at Sandia National Laboratories as a principal materials scientist in Materials Chemistry Department. She is a recognized subject matter expert in thermal-physical and electrical characterization of materials, thermoelectric materials, aging and lifetime materials predictions, materials compatibility, thermal energy storage, solar photo-conversion, supply chain risk and counterfeit detection.

Dr. Yueping Fu

Senior Scientist

ADA Technologies, Inc.

Dr. Yueping Fu is an experienced professional with extensive corporate R&D experience with on advanced materials and their chemistry. He has broad industry experience with polymer composite applications, spanning from the chemical industry, to electronic device to and medical device space. He has successfully introduced many innovative products to market. His research includes design, formulation, fabrication, processing and characterization of polymer composite systems for application in electronic and medical devices. He has published a dozen of journal articles and has authored of several book chapters.  He holds 10 patents.

Linda Engelbrect

Research Engineer, PhD • PMIC

Linda Engelbrecht currently researches and applies thermal testing and analysis for the physical characterization of materials at PMIC in Corvallis, Oregon. She previously did analog/mixed signal circuit design for Hewlett Packard prior to her doctoral program. She holds a Ph.D. in Applied Magnetics (2011) and an M.S. in Analog and Mixed Signal Design (1996), both from the School of Electrical Engineering and Computer Science at Oregon State University. Her Bachelor’s degree is from the University of California, San Diego, in Applied Mathematics and Engineering Sciences.

Jerry Beeney

Global Business Development Manager • FLIR

Jerry Beeney holds a Bachelor of Science in Mechanical Engineering and has worked for FLIR Systems for over 15 years.  During his time as a Sales Engineer in FLIR Systems’ Science Camera Segment, he provided technical sales and support services to clients across a broad range of industries throughout the upper-Midwest.  He now uses this sales and customer-facing experience in his current position as the Strategic Business Development Manager where he focuses on driving long-term, sustained growth of the global Science business within FLIR Instruments.


John Wilson

Electronics Business Development Manager - Mentor Graphics

John Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) that is
now part of Siemens Digital Industries Software in 1999 and has over 19 years of thermal design experience relating to simulation and testing. He has worked on or managed more than 100+ thermal and airflow design consulting projects ranging from component level, PCB, Enclosure and System Level inclusive of a wide range of applications including consumer, communications, industrial and automotive electronics.  John developed a practical and comprehensive knowledge of IC package level thermal test and analysis correlation through his work in the Mentor, Fremont, CA. test facilities.

Alexander Fischer

Co-Founder & Product Manager

SimScale GmbH

With a background in computational mechanics and control technology, Alex Fischer worked for 10 years in different product and engineering roles, building a fully cloud- and web-based simulation platform. He is a co-founder of SimScale and leads the company's efforts for thermal management and electronics solutions.

Keith Beers

Principal Engineer, PhD, PE

Exponent, Inc.

Keith Beers is a Principal Engineer at Exponent, a failure analysis and technical consulting firm. He assists clients in managing the risks related to products containing lithium-ion batteries through proactive battery qualification studies, risk mitigation strategies such as FMEA, failure analysis, and provides product recall support. Keith holds degrees in Chemical Engineering, with a Ph.D. from the University of California, Berkeley and a B.S. from the University of Colorado, Boulder. He is also a licensed chemical engineer by the California Board for Professional Engineers and Land Surveyors.



Roth, PhD

Project Manager – Thermal Management

ADA Technologies, Inc.

Dr. Roth is a Project Manager and Senior Research Engineer in the Thermal Management team at ADA Technologies. Currently, he is the PI of two projects related to ADA’s Cell Isolation Material (CIM). Dr. Roth joined ADA in July 2015 as a Research Engineer after graduating with a Ph.D. in Chemical Engineering from the Colorado School of Mines. Before joining ADA, Dr. Roth’s work focused on developing individual cell flow cytometers by combining custom optical systems with microfluidic devices, during which he published three articles and was awarded one patent. Since joining ADA, he has been involved with a number of Army, Navy, and Air Force SBIR Phase I and II projects as the primary research engineer. 




Director - Electronic Cooling Solutions

Guy Wagner has 45 years experience in the electronics industry and has been doing consulting since 2001. He has authored over 40 papers and presentations at international conferences and has 29 issued patents. Before joining Electronic Cooling Solutions as a Director, Guy held the position of Director of Engineering at Cornice Inc., Chief Scientist at HP and Agilent Technologies and MTS at Bell Laboratories.


Beth Langer

Lead Engineer, Thermal Management

Colder Products Co.

Beth Langer is the Lead Technical Engineer in the Thermal Management Business Unit at CPC. She earned her Bachelor and Master of Science degrees in Mechanical Engineering from the University of St. Thomas in St. Paul, MN. Over the course of her career, she has  been responsible for product design, reliability and technical innovation for industrial products. Besides leading design solutions that serve CPC customers, she is an active consulting member on ASHRAE and OCP committees.


Dr. Yong Joon Lee

 R&D Director Polymer Composite Materials • Nanoramic Labs

Joon has extensive industry experience working on hands-on engineering and product development. Before he recently joined Nanoramic Laboratories as R&D Director -Polymer Composite Materials, he had over 10 years experience with a global manufacturer of thermal interface materials (TIMs), conductive plastics and EMI shielding products. He was a technical team leader for TIM product development and commercialization utilizing different resin chemistry, surface treatment, ceramic and metallic fillers and processing development.  



President • Epner Technology

David is the president of Epner Technology, the only plating company who has had a proprietary process, Laser Gold, selected for its peerless IR reflectivity, by the National Institute of Standards and Technology, (NIST)  for their catalog of Standard Reference Materials!


Dave Dewire

VP of Business Development 

Hermetic Solutions Group

Dave DeWire is the Vice President of Business Development for Hermetic Solutions Group with a strong background in Thermal Management in device packaging for High Frequency and High Power applications.  He has broad industry experience across multiple packaging architectures which include the use of Metals, Metal Matrix Composites, Multilayer Ceramics, Plastics, Direct Bond Copper and other CTE matched technologies.  His role as Business Development with HSG is focused on high reliability technologies for harsh environment applications which includes: packages, lids, connectors and feedthrus, getters and absorbers, solder preforms and sealing of ceramic and high-rel packaging.  He holds degrees in International Business and Marketing and is the Co-Holder of 4 patents on Modular Low Stress Packaging Technologies.   

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