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Panel: Innovations and Challenges in Next-Generation Thermal Materials

As technology continues to advance, the demand for more powerful and compact electronic devices is on the rise. Efficient heat management is crucial for ensuring the optimal performance and reliability of these devices. This panel will explore the latest developments in Next-Generation Thermal Materials that play a pivotal role in enhancing heat dissipation and thermal conductivity. Experts from industry and academia will discuss innovative materials, fabrication techniques, and the challenges associated with implementing these materials in various applications. Join us to gain insights into how thermal interface materials can address the thermal management needs of emerging technologies such as high-performance computing, 5G, electric vehicles, and more.


Chris Martino

Henkel Corporation

Global Application Engineer

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