High-Performance Thermally Conductive Low Dielectric Constant Ceramics for Thermal Management in Electronics Packaging
Hexagonal boron nitride (h-BN) stands out as one of the premier ceramic fillers for enhancing thermal conductivity (TC) in polymeric thermal management materials. This enhancement is achieved without compromising the polymer’s electrical insulation or signal transmission. Thermal interface materials (TIM) filled with BN are prevalently used in electronic packaging, enabling efficient heat dissipation without compromising electrical insulation.
While integrating BN considerably boosts the TC of neat resins, our internal research into dielectric properties (like dielectric strength and dielectric constant) reveals that BN-filled polymer composites retain almost the same exemplary dielectric performance as unfilled polymer resins.