Nanoramic Laboratories Launches Thermexit Line of Thermal Interface Materials
Nanoramic Laboratories has launched Thermexit, a line of high-end thermal interface gap filler pads featuring high thermal conductivity and high thermal stability. The Thermexit line includes Thermexit-HP-40, a high performance TIM Gap Filler and Thermexit-El-20, an electrically insulating TIM Gap Filler. Thermexit gap filler pads are the only thermal management system on the market that provides high thermal conductivity without the use of silicone-based resin. This results in the elimination of any issues from silicone oil which may reduce TIM performance and harm electronic components.
“Nanoramic has long developed energy storage nanomaterial designed for record setting performance in high temperature environments,” said Eric Kish, Nanoramic’s Chief Executive Officer. “Using our expertise in engineering the thermal properties of materials at the nanoscopic scale, we have created the Thermexit line of thermal interface materials to provide high performance thermal management across a wide range of applications.”
Key Features of Thermexit Include:
Non-Silicone, non-reactive, no-cure system: No resin-filler separation or unconsumed reactant outgassing
High thermal stability: Continuous operation over 150°C
High thermal conductivity: >40W/mK for the Thermexit-HP-40 and >20W/mK for the Thermexit-El-20
Easy pick and place application: Naturally sticky without residue/mess
Highly compressible: Minimizes contact resistance without high force and component stress
Applications of the Thermexit product line include consumer electronics, power supplies, automotive electronics, LED, LCD and optical displays, motor controls, high power density semiconductors, batteries and energy storage devices.