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DuPont Microcircuit Materials Introduces New Sinter Silver Product

DuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach that improves reliability and productivity in the power module assembly process.

The product, DuPont DA510, is an advanced pressure sintering silver paste that delivers high thermal and electrical conductivity, fast takt time and superior sintered density. The associated thermal cycle reliability enables the assembly of high performance and high-density power modules for the automotive power electronics industry segment. The new sintering silver, from the DuPont Microcircuit Materials business, is ideally suited to enable the utilization of wide band semiconductor MOSFET chips in the rapidly increasing auto electrification market and beyond. DuPont™ DA510 has also shown promising results for potential use in power module heat sink attachment applications due to its ability for high quality, large area prints.


“The DuPont DA510 sinter silver offers excellent reliability and productivity and we will continue to innovate and build on this technology,” said Peter Weigand, Global Automotive Segment Manager, DuPont Microcircuit Materials. “This newest offering demonstrates a range of superior technical properties to meet different customers’ manufacturing process requirements. We are excited about introducing this new product to our customers globally and expect very positive results from early adoption customers.”

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