Dow Introduces Gap Filler with Strong Thermal Conductivity and Slump Resistance
Dow has introduced new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.
This two-part TIM and gap filler allow electronic designers to replace traditional, fabricated pads of various thicknesses with a single UL 94 V-0 material for dispensing or printing through a choice of manual and automated processes. New DOWSIL TC-4040 Dispensable Thermal Pad supports either room temperature or accelerated curing and delivers highly reliable thermal and mechanical performance.
“Thermal interface materials for telecom and network equipment and other advanced devices need to dissipate significant amounts of heat in 5G network and cloud computing systems,” said Samuel Liu, marketing manager and segment leader, Dow. “At the same time, manufacturers need new material solutions that enable reduced labor costs and more efficient assembly. Our new DOWSIL TC-4040 Dispensable Thermal Pad is an innovative addition to Dow’s strong and growing portfolio of thermally conductive materials. Its launch underscores Dow’s ongoing commitment to its customers to develop cutting-edge materials that provide a precise balance of properties for outstanding thermal and mechanical performance.”
Dow’s DOWSIL TC-4040 Dispensable Thermal Pad supports automated dispensing, stencil printing and screen printing. Piston pump and plunger metering is recommended for dispensing because of the material’s high filler loading. DOWSIL TC-4040 Dispensable Thermal Pad offers a superior extrusion rate and delivers precise component coverage with needle dispensing. This high thermally conductive material (4.0W/mk) has a working time of two to four hours.
DOWSIL TC-4040 Dispensable Thermal Pad is a reworkable gap filler that is supplied as a two-part liquid component kit and has a shelf life of up to six months at room temperature due to its dependable material properties and ease-of-storage. It has excellent reliability of thermal management performance that can resist various harsh environmental testing (e.g. 1000-hour aging test at 150C, 1000 cycles thermal shock from -45C to 125C and 1,000-hour 85/85% RH (high-temperature/high-humidity) aging test).