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THERMAL 2021

  • ACI Technologies 

  • ADA Technologies

  • AddEnergie

  • Advanced Cooling Tech

  • AGC Business Development

  • AMAT

  • Amazon

  • Applied Materials

  • ARPA-E

  • Asetek

  • Aurora Circuits

  • Beijing Xiaomi Mobile

  • C-Therm Technologies

  • CALYOS

  • Cargill

  • CPC

  • Dell

  • Delta Electronics

  • Drexel University

  • DSA

  • Eaton

  • EFACEC Electric Mobility

  • Efficient Power Conversion

  • Electronic Cooling Solutions

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CONFERENCE

  • Electronics Weekly

  • eXclaim IP LLC

  • Facebook

  • Ford Motor Co.

  • Fujitsu Limited

  • Garnett Component Sales

  • General Silicones

  • Gentex

  • Greystone, Inc

  • HENKEL

  • Hermetic Solutions Group

  • ​Hexagon

  • Holo, Inc.

  • Honeywell International

  • Huawei Technologies GmbH

  • HYMET Thermal Interfaces

  • IDTechEX

  • Intel

  • Intelli Science Institute

  • ITRON Inc

  • JNC Corp.

  • Julabo USA

  • Kaga Electronics

  • Kelvin Thermal Technologies

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PARTICIPATING

  • Laird

  • Lenovo

  • LG

  • Liquidcool Solutions

  • Medha Servo Drives

  • Miba Sinter Austria

  • Micro Nano Technologies

  • Microgravity Research Center Ecole Polytech de Bruxelles

  • Microchip Technologies, Inc.

  • Microtek Laboratories

  • MSC Software

  • Nanoramic Labs

  • NASA Jet Propulsion Lab

  • NXP Semiconductor

  • Pankaj Electronics

  • Parker-Hannifin Corp.

  • Pixus Technlogy

  • Power Electronics News

  • Qorvo

  • Rogers Corp.

  • Rolls Royce NA Technologies

  • San Jose St. University

  • Sekisui Polymatech

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COMPANIES

  • SHT Smart High Tech AB

  • Siemens Digital Software

  • Silicon Labs

  • SONNEN, Inc.

  • Spectronics Corp.

  • SSGmfg LLC

  • STMicroelectronics

  • Texas A&M

  • Thermexit

  • Toshiba America 

  • UnitedSIC

  • University of Maryland

  • University of Virginia 

  • Vanguard Products Corp.

  • VELO3D

  • Virginia Tech

  • Wartsila

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