THERMAL 2022
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ACI Technologies
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ADA Technologies
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AddEnergie
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Advanced Cooling Tech
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AGC Business Development
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AMAT
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Amazon
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Applied Materials
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ARPA-E
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Asetek
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Aurora Circuits
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Beijing Xiaomi Mobile
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C-Therm Technologies
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CALYOS
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Cargill
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CPC
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Dell
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Delta Electronics
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Drexel University
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DSA
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Eaton
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EFACEC Electric Mobility
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Efficient Power Conversion
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Electronic Cooling Solutions

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Electronics Weekly
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eXclaim IP LLC
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Facebook
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Ford Motor Co.
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Fujitsu Limited
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Garnett Component Sales
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General Silicones
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Gentex
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Greystone, Inc
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HENKEL
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Hermetic Solutions Group
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Hexagon
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Holo, Inc.
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Honeywell International
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Huawei Technologies GmbH
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HYMET Thermal Interfaces
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IDTechEX
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Intel
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Intelli Science Institute
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ITRON Inc
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JNC Corp.
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Julabo USA
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Kaga Electronics
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Kelvin Thermal Technologies

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Laird
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Lenovo
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LG
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Liquidcool Solutions
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Medha Servo Drives
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Miba Sinter Austria
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Micro Nano Technologies
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Microgravity Research Center Ecole Polytech de Bruxelles
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Microchip Technologies, Inc.
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Microtek Laboratories
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MSC Software
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Nanoramic Labs
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NASA Jet Propulsion Lab
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NXP Semiconductor
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Pankaj Electronics
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Parker-Hannifin Corp.
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Pixus Technlogy
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Power Electronics News
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Qorvo
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Rogers Corp.
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Rolls Royce NA Technologies
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San Jose St. University
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Sekisui Polymatech

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SHT Smart High Tech AB
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Siemens Digital Software
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Silicon Labs
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SONNEN, Inc.
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Spectronics Corp.
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SSGmfg LLC
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STMicroelectronics
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Texas A&M
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Thermexit
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Toshiba America
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UnitedSIC
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University of Maryland
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University of Virginia
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Vanguard Products Corp.
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VELO3D
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Virginia Tech
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Wartsila
