Thermal Model

A Material’s Insulating Properties can be Tuned at Will

MIT's Thermal Material’s Insulating Properties can be Tuned at Will

New heat model may help electronic devices last longer

A University of Illinois team of engineers has found that the model currently used to predict heat loss in a common semiconductor materials

OnLogic Transforms Their Design Testing Process Using Cloud-Based Simulation from SimScale

SimScale has announced the OnLogic has integrated the cloud-based simulation platform into their design testing.

nTop Platform 2.0 Delivers the Power of Computational Modeling to a Wider Audience

nTop Platform 2.0 Delivers the Power of Computational Modeling to a Wider Audience.

THERMAL 2022