A Material’s Insulating Properties can be Tuned at Will
MIT's Thermal Material’s Insulating Properties can be Tuned at Will
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THERMAL 2022
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Nick D
- Dec 18, 2019
- 2 min
New heat model may help electronic devices last longer
A University of Illinois team of engineers has found that the model currently used to predict heat loss in a common semiconductor materials
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Nick D
- Dec 5, 2019
- 1 min
OnLogic Transforms Their Design Testing Process Using Cloud-Based Simulation from SimScale
SimScale has announced the OnLogic has integrated the cloud-based simulation platform into their design testing.
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Nick D
- Nov 25, 2019
- 2 min
nTop Platform 2.0 Delivers the Power of Computational Modeling to a Wider Audience
nTop Platform 2.0 Delivers the Power of Computational Modeling to a Wider Audience.
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