Nick DJul 26, 20211 minNew Silicone FreeForm-in-Place Thermal Gap FillerSARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W
Nick DJul 1, 20212 minHeat-Management Material from Researchers at UCLA Keeps Semiconductors Running CoolUCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat.
Nick DJun 21, 20212 minIDTechEx Reveals How Key Data Center Trends Impact Thermal Interface MaterialsAdvancements in Thermal Management Speaking company IDTechEx expects to see more passively cooled centers.
Nick DMay 27, 20211 minDuPont Microcircuit Materials Introduces New Sinter Silver ProductDuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach.
Nick DMay 25, 20211 minLow Compression Force4.5-Watt Thermal Gap FillerSARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.
Nick DMay 12, 20212 minElectric Vehicles to Drive Demand for Thermal Interface Materials Says IDTechExThermal Interface Materials 2021-2031: Technologies, Markets and Opportunities market report from IDTechX
Nick DMay 11, 20211 minElement Solutions, Inc. Acquires of H.K. Wentworth GroupElement Solutions, Inc. has acquired H.K. Wentworth Limited.
Nick DMay 10, 20213 minTirupati Develops new Graphene-Aluminum CompositeTirupati Graphene and Mintech Research Centre (TGMRC) has developed a new graphene-aluminum composite.
Nick DApr 22, 20211 minDuPont to Build New Adhesives Manufacturing Facility in East ChinaDuPont is investing approximately $30 million to build a new manufacturing facility in Zhangjiagang, Jiangsu Province in East China.
Nick DMar 29, 20211 minNew 3.0 W/m•K Form-In-Place Gap FillerFujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
Nick DMar 15, 20213 minNew CRADA between NPS and BNNano to Research Nanomaterial ApplicationsThe Naval Postgraduate School (NPS) has entered into a Cooperative Research and Development Agreement (CRADA) with BNNano.
Nick DMar 10, 20213 minDuPont to Acquire Laird Performance Materials from Advent InternationalDuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.
Nick DFeb 18, 20211 minNew 8.0-Watt Thermal PuttyFujipoly has introduced of SARCON PG80B, its newest high-performance putty-like thermal interface material.
Nick DFeb 15, 20212 minII-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal ConductivityII-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Module
Nick DSep 22, 20201 minSetting the Standard for TIMsFujipoly offers four formulations of Standard Performance Gap Filler Pads.
Nick DSep 9, 20202 minConsolidation, automation & Electric Vehicles: Automotive Engineers Outline their Thermal ChallengesNew research from Future Facilities, maker of the 6SigmaET thermal simulation software, has revealed the top thermal trends and challenges f
Nick DSep 1, 20201 minA Perfect Fit for TransistorsFujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling
Nick DJul 27, 20202 minKULR Technology Forms Partnership with Drako Motors for Carbon Fiber Cooling TechnologyKULR Technology Forms Partnership with Drako Motors for Carbon Fiber Cooling Technology