SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W

Advancements in Thermal Management Speaking company IDTechEx expects to see more passively cooled centers.

DuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach.

SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.

Thermal Interface Materials 2021-2031: Technologies, Markets and Opportunities market report from IDTechX

Element Solutions, Inc. has acquired H.K. Wentworth Limited.

EXAIR’s Cabinet Cooler systems can be customized to provide cooling within electrical enclosures in NEMA 12, NEMA 4, NEMA 4X locations.

Fujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.

The Naval Postgraduate School (NPS) has entered into a Cooperative Research and Development Agreement (CRADA) with BNNano.

DuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.

II-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Module

Fujipoly offers four formulations of Standard Performance Gap Filler Pads.

New research from Future Facilities, maker of the 6SigmaET thermal simulation software, has revealed the top thermal trends and challenges f

Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling

New Sarcon Sample Kit from Fujipoly

5G: Opportunities for Thermal Management Materials

UW Research Develops Laser that Allows Solid-State Refrigeration of a Semiconductor Material

Dow Introduces Gap Filler with Strong Thermal Conductivity and Slump Resistance

Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure

High Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market