Nick DJul 26, 20211 minNew Silicone FreeForm-in-Place Thermal Gap FillerSARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W
Nick DJun 21, 20212 minIDTechEx Reveals How Key Data Center Trends Impact Thermal Interface MaterialsAdvancements in Thermal Management Speaking company IDTechEx expects to see more passively cooled centers.
Nick DMay 27, 20211 minDuPont Microcircuit Materials Introduces New Sinter Silver ProductDuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach.
Nick DMay 25, 20211 minLow Compression Force4.5-Watt Thermal Gap FillerSARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.
Nick DMay 12, 20212 minElectric Vehicles to Drive Demand for Thermal Interface Materials Says IDTechExThermal Interface Materials 2021-2031: Technologies, Markets and Opportunities market report from IDTechX
Nick DMay 11, 20211 minElement Solutions, Inc. Acquires of H.K. Wentworth GroupElement Solutions, Inc. has acquired H.K. Wentworth Limited.
Nick DApr 21, 20211 minCustom Cabinet Coolers for Electrical Enclosures ReleasedEXAIR’s Cabinet Cooler systems can be customized to provide cooling within electrical enclosures in NEMA 12, NEMA 4, NEMA 4X locations.
Nick DMar 29, 20211 minNew 3.0 W/m•K Form-In-Place Gap FillerFujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
Nick DMar 15, 20213 minNew CRADA between NPS and BNNano to Research Nanomaterial ApplicationsThe Naval Postgraduate School (NPS) has entered into a Cooperative Research and Development Agreement (CRADA) with BNNano.
Nick DMar 10, 20213 minDuPont to Acquire Laird Performance Materials from Advent InternationalDuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.
Nick DFeb 15, 20212 minII-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal ConductivityII-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Module
Nick DSep 22, 20201 minSetting the Standard for TIMsFujipoly offers four formulations of Standard Performance Gap Filler Pads.
Nick DSep 9, 20202 minConsolidation, automation & Electric Vehicles: Automotive Engineers Outline their Thermal ChallengesNew research from Future Facilities, maker of the 6SigmaET thermal simulation software, has revealed the top thermal trends and challenges f
Nick DSep 1, 20201 minA Perfect Fit for TransistorsFujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling
Nick DJun 26, 20203 minSub-6GHz and mmWave 5G: Opportunities for Thermal Management Materials5G: Opportunities for Thermal Management Materials
Nick DJun 24, 20203 minUW Research Develops Laser that Allows Solid-State Refrigeration of a Semiconductor MaterialUW Research Develops Laser that Allows Solid-State Refrigeration of a Semiconductor Material
Nick DJun 18, 20202 minDow Introduces Gap Filler with Strong Thermal Conductivity and Slump ResistanceDow Introduces Gap Filler with Strong Thermal Conductivity and Slump Resistance
Nick DJun 15, 20202 minMinimizing Thermal Conductivity of Crystalline Material with Optimal NanostructureMinimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
Nick DJun 11, 20202 minHigh Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the MarketHigh Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market