New Silicone FreeForm-in-Place Thermal Gap Filler
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W
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Nick D
- Jun 21, 2021
- 2 min
IDTechEx Reveals How Key Data Center Trends Impact Thermal Interface Materials
Advancements in Thermal Management Speaking company IDTechEx expects to see more passively cooled centers.
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Nick D
- May 27, 2021
- 1 min
DuPont Microcircuit Materials Introduces New Sinter Silver Product
DuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach.
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Nick D
- May 25, 2021
- 1 min
Low Compression Force4.5-Watt Thermal Gap Filler
SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.
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Nick D
- May 12, 2021
- 2 min
Electric Vehicles to Drive Demand for Thermal Interface Materials Says IDTechEx
Thermal Interface Materials 2021-2031: Technologies, Markets and Opportunities market report from IDTechX
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Nick D
- May 11, 2021
- 1 min
Element Solutions, Inc. Acquires of H.K. Wentworth Group
Element Solutions, Inc. has acquired H.K. Wentworth Limited.
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Nick D
- Apr 21, 2021
- 1 min
Custom Cabinet Coolers for Electrical Enclosures Released
EXAIR’s Cabinet Cooler systems can be customized to provide cooling within electrical enclosures in NEMA 12, NEMA 4, NEMA 4X locations.
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Nick D
- Mar 29, 2021
- 1 min
New 3.0 W/m•K Form-In-Place Gap Filler
Fujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
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Nick D
- Mar 15, 2021
- 3 min
New CRADA between NPS and BNNano to Research Nanomaterial Applications
The Naval Postgraduate School (NPS) has entered into a Cooperative Research and Development Agreement (CRADA) with BNNano.
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Nick D
- Mar 10, 2021
- 3 min
DuPont to Acquire Laird Performance Materials from Advent International
DuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.
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Nick D
- Feb 15, 2021
- 2 min
II-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity
II-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Module
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Nick D
- Sep 22, 2020
- 1 min
Setting the Standard for TIMs
Fujipoly offers four formulations of Standard Performance Gap Filler Pads.
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Nick D
- Sep 9, 2020
- 2 min
Consolidation, automation & Electric Vehicles: Automotive Engineers Outline their Thermal Challenges
New research from Future Facilities, maker of the 6SigmaET thermal simulation software, has revealed the top thermal trends and challenges f
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Nick D
- Sep 1, 2020
- 1 min
A Perfect Fit for Transistors
Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling
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Nick D
- Jun 26, 2020
- 3 min
Sub-6GHz and mmWave 5G: Opportunities for Thermal Management Materials
5G: Opportunities for Thermal Management Materials
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Nick D
- Jun 24, 2020
- 3 min
UW Research Develops Laser that Allows Solid-State Refrigeration of a Semiconductor Material
UW Research Develops Laser that Allows Solid-State Refrigeration of a Semiconductor Material
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Nick D
- Jun 18, 2020
- 2 min
Dow Introduces Gap Filler with Strong Thermal Conductivity and Slump Resistance
Dow Introduces Gap Filler with Strong Thermal Conductivity and Slump Resistance
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Nick D
- Jun 15, 2020
- 2 min
Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
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Nick D
- Jun 11, 2020
- 2 min
High Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market
High Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market
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