SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W

SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.

Fujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.

DuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.

Fujipoly offers four formulations of Standard Performance Gap Filler Pads.

High Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market

Fujipoly has released Sarcon GR130A, its newest high-performance, thermal gap filler pad.

Fujipoly introduces Sarcon PG45A its newest high-performance, putty-like thermal interface material

Nanoramic Laboratories has launched Thermexit, a line of high-end thermal interface gap filler pads.