Nick DJul 26, 20211 minNew Silicone FreeForm-in-Place Thermal Gap FillerSARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W
Nick DMay 25, 20211 minLow Compression Force4.5-Watt Thermal Gap FillerSARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.
Nick DMar 29, 20211 minNew 3.0 W/m•K Form-In-Place Gap FillerFujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
Nick DMar 10, 20213 minDuPont to Acquire Laird Performance Materials from Advent InternationalDuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.
Nick DSep 22, 20201 minSetting the Standard for TIMsFujipoly offers four formulations of Standard Performance Gap Filler Pads.
Nick DJun 11, 20202 minHigh Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the MarketHigh Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market
Nick DMay 28, 20201 minNew 13-Watt Thermal Gap FillerFujipoly has released Sarcon GR130A, its newest high-performance, thermal gap filler pad.
Nick DApr 28, 20201 minNew 4.5-Watt Thermal PuttyFujipoly introduces Sarcon PG45A its newest high-performance, putty-like thermal interface material
Nick DJan 29, 20201 minNanoramic Laboratories Launches Thermexit Line of Thermal Interface MaterialsNanoramic Laboratories has launched Thermexit, a line of high-end thermal interface gap filler pads.