New Silicone FreeForm-in-Place Thermal Gap Filler
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W
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THERMAL 2022
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Nick D
- May 25, 2021
- 1 min
Low Compression Force4.5-Watt Thermal Gap Filler
SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials.
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Nick D
- Mar 29, 2021
- 1 min
New 3.0 W/m•K Form-In-Place Gap Filler
Fujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
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Nick D
- Mar 10, 2021
- 3 min
DuPont to Acquire Laird Performance Materials from Advent International
DuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.
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Nick D
- Sep 22, 2020
- 1 min
Setting the Standard for TIMs
Fujipoly offers four formulations of Standard Performance Gap Filler Pads.
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Nick D
- Jun 11, 2020
- 2 min
High Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market
High Thermal Conductivity, Fast Dispensing Liquid Thermal Interface Material Arrives on the Market
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Nick D
- May 28, 2020
- 1 min
New 13-Watt Thermal Gap Filler
Fujipoly has released Sarcon GR130A, its newest high-performance, thermal gap filler pad.
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Nick D
- Apr 28, 2020
- 1 min
New 4.5-Watt Thermal Putty
Fujipoly introduces Sarcon PG45A its newest high-performance, putty-like thermal interface material
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Nick D
- Jan 29, 2020
- 1 min
Nanoramic Laboratories Launches Thermexit Line of Thermal Interface Materials
Nanoramic Laboratories has launched Thermexit, a line of high-end thermal interface gap filler pads.
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