Heat-Management Material from Researchers at UCLA Keeps Semiconductors Running Cool
UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat.
Heat-Management Material from Researchers at UCLA Keeps Semiconductors Running Cool
Electric Vehicles to Drive Demand for Thermal Interface Materials Says IDTechEx
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New CRADA between NPS and BNNano to Research Nanomaterial Applications
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UW Research Develops Laser that Allows Solid-State Refrigeration of a Semiconductor Material
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Room-Temperature Bonded Interface Improves Cooling of Gallium Nitride Devices
A Material’s Insulating Properties can be Tuned at Will
A Novel Formulation to Explain Heat Propagation
Phonon Hydrodynamics and Ultrahigh-Room Temperature Thermal Conductivity in Thin Graphite
Coating Helps Electronics Stay Cool by Sweating
New Material is Heat-Insulating and Heat-Conducting at the Same Time
Isotopically Enriched Cubic Boron Nitride Reveals High Thermal Conductivity
Engineers Develop Metals that Change Surfaces in Response to Heat