New Silicone FreeForm-in-Place Thermal Gap Filler
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W
THERMAL 2022
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Nick D
- Jul 1, 2021
- 2 min
Heat-Management Material from Researchers at UCLA Keeps Semiconductors Running Cool
UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat.
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Nick D
- May 27, 2021
- 1 min
DuPont Microcircuit Materials Introduces New Sinter Silver Product
DuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach.
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Nick D
- May 12, 2021
- 2 min
Electric Vehicles to Drive Demand for Thermal Interface Materials Says IDTechEx
Thermal Interface Materials 2021-2031: Technologies, Markets and Opportunities market report from IDTechX
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Nick D
- May 11, 2021
- 1 min
Element Solutions, Inc. Acquires of H.K. Wentworth Group
Element Solutions, Inc. has acquired H.K. Wentworth Limited.
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Nick D
- May 10, 2021
- 3 min
Tirupati Develops new Graphene-Aluminum Composite
Tirupati Graphene and Mintech Research Centre (TGMRC) has developed a new graphene-aluminum composite.
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Nick D
- May 5, 2021
- 2 min
Wagner Machine Company Takes Delivery of VELO3D Manufacturing Solution for 3D Printing ‘Impossible’
VELO3D Inc. has announced the delivery of a state-of-the-art aluminum F357 metal AM solution to Wagner Machine Company.
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Nick D
- Apr 22, 2021
- 1 min
DuPont to Build New Adhesives Manufacturing Facility in East China
DuPont is investing approximately $30 million to build a new manufacturing facility in Zhangjiagang, Jiangsu Province in East China.
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Nick D
- Apr 21, 2021
- 1 min
Custom Cabinet Coolers for Electrical Enclosures Released
EXAIR’s Cabinet Cooler systems can be customized to provide cooling within electrical enclosures in NEMA 12, NEMA 4, NEMA 4X locations.
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Nick D
- Mar 29, 2021
- 1 min
New 3.0 W/m•K Form-In-Place Gap Filler
Fujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
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Nick D
- Mar 15, 2021
- 3 min
New CRADA between NPS and BNNano to Research Nanomaterial Applications
The Naval Postgraduate School (NPS) has entered into a Cooperative Research and Development Agreement (CRADA) with BNNano.
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Nick D
- Mar 10, 2021
- 3 min
DuPont to Acquire Laird Performance Materials from Advent International
DuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.
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Nick D
- Feb 18, 2021
- 1 min
New 8.0-Watt Thermal Putty
Fujipoly has introduced of SARCON PG80B, its newest high-performance putty-like thermal interface material.
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Nick D
- Sep 22, 2020
- 1 min
Setting the Standard for TIMs
Fujipoly offers four formulations of Standard Performance Gap Filler Pads.
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Nick D
- Sep 9, 2020
- 2 min
Consolidation, automation & Electric Vehicles: Automotive Engineers Outline their Thermal Challenges
New research from Future Facilities, maker of the 6SigmaET thermal simulation software, has revealed the top thermal trends and challenges f
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Nick D
- Sep 1, 2020
- 1 min
A Perfect Fit for Transistors
Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling
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Nick D
- Jul 27, 2020
- 2 min
KULR Technology Forms Partnership with Drako Motors for Carbon Fiber Cooling Technology
KULR Technology Forms Partnership with Drako Motors for Carbon Fiber Cooling Technology
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Nick D
- Jul 7, 2020
- 2 min
Unifrax Acquires Rex Materials Group
Unifrax Acquires Rex Materials Group
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Nick D
- Jul 6, 2020
- 2 min
Depth Thermography Measures Temperature in 3D Objects
Depth Thermography Measures Temperature in 3D Objects
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