SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W

UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat.

DuPont has introduced an advanced screen printable sinter silver product for power semiconductor die attach.

Thermal Interface Materials 2021-2031: Technologies, Markets and Opportunities market report from IDTechX

Element Solutions, Inc. has acquired H.K. Wentworth Limited.

Tirupati Graphene and Mintech Research Centre (TGMRC) has developed a new graphene-aluminum composite.

VELO3D Inc. has announced the delivery of a state-of-the-art aluminum F357 metal AM solution to Wagner Machine Company.

DuPont is investing approximately $30 million to build a new manufacturing facility in Zhangjiagang, Jiangsu Province in East China.

EXAIR’s Cabinet Cooler systems can be customized to provide cooling within electrical enclosures in NEMA 12, NEMA 4, NEMA 4X locations.

Fujipoly has introduced SARCON LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.

The Naval Postgraduate School (NPS) has entered into a Cooperative Research and Development Agreement (CRADA) with BNNano.

DuPont has entered into a definitive agreement with Advent International acquire Laird Performance Materials.

Fujipoly has introduced of SARCON PG80B, its newest high-performance putty-like thermal interface material.

Fujipoly offers four formulations of Standard Performance Gap Filler Pads.

New research from Future Facilities, maker of the 6SigmaET thermal simulation software, has revealed the top thermal trends and challenges f

Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling

KULR Technology Forms Partnership with Drako Motors for Carbon Fiber Cooling Technology

New Sarcon Sample Kit from Fujipoly

Unifrax Acquires Rex Materials Group

Depth Thermography Measures Temperature in 3D Objects