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Submitting an Abstract

Submitting a Proposal: The basis of the proposal or the presentation may not be the promotion or marketing of a product.

Please note, speaking submissions will be accepted only electronically by email. Send your proposal in the body of your email letter and include supporting material and complete presentations as attachments. Submit to Nick Depperschmidt.


The speaking proposal should include:

  • A title for the presentation

  • A summary of the presentation content (200-300 words)

  • Presenter(s) biography and high-resolution head-shot

  • Contact information: name, title, company, address, phone, email address and website

  • Desired Speaking Track

Your Technology Needs: Speakers must indicate any other technology that you plan to bring and/or need. Include any other pertinent information about your technology requirements.

Call for Presentations

Join other industry visionaries and speak at the Advancements in Thermal Management conference. This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry.

There are a limited number of speaking opportunities available, so it is imperative that you submit your abstract by the March 27th, 2020 call for papers deadline.

  • Upcoming and Emerging Technologies for Thermal Management

  • Market Opportunities for Thermal Products and Services

  • Thermal Materials (TIMs)

  • Thermal Modeling

  • Characterization and Measurement for Thermal Materials

  • Infrared/Thermography

  • Cooling Technology (including Air, Liquid and Vibration Cooling)

  • LED Cooling

  • IC Level Thermal Management

  • R&D in Thermal Management Related Spaces

  • Thermistors, Thermocouples, Thermoelectrics and Insulation

  • Thermal Sensing and Measurement (Sensors, Instruments, & Test Equipment)

  • Thermal Control

  • Heat Pipes

  • Additive Manufacturing

  • Thermal Ground Planes

  • Two Phase Cooling

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