The Advancements in Thermal Management Conference is back, in-person, in Denver. If you are a designer of a product or system that needs to mitigate heat, this is the conference for you. Attend to learn about the latest Thermal Management Technologies for Electronics Packaging. ​

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For more than a decade professionals in the automotive, semiconductor, aviation, aerospace, lighting, power, electronics and other industries have been coming to conference to learn about the latest developments in the market.  Attend to learn how you can eliminate hear related product and component failures in your systems at this unique and interactive thermal management conference.

• Do you work in Electronics Product Design? Learn about advances in thermal materials, thermal design and simulation, and heat transfer in electronics packaging. 

• Are you designing telecom infrastructure systems? Learn how to cool the systems that support 5G/high speed connections for reliable connectivity.

• Learn how acoustic imaging and testing can help you avoid failures in control modules and high-voltage IGBTs.

• Does your high power application demand liquid or forced air cooling? Learn how chillers and fans can transfer heat away from your components and increase thermal stability.  

• CTO/CEOs

• Engineers/Technical Directors

• Product Designers 

• Application Engineers

• System Engineers

• Academia

• Software Engineers

• Thermal Scientists

• Consultants

• Sales and Marketing

• Product Managers