2021 Virtual Event

After the great success of the 2020 event, the Advancements in Thermal Management will once again be a digital conference. If you are a designer of a product or system that needs to mitigate heat, this is the conference for you. Attend to learn about the latest Thermal Management Technologies for Electronics Packaging. 

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• Do you work in Electronics Product Design? Learn about advances in thermal materials, thermal design and simulation, and heat transfer in electronics packaging. 

• Are you designing telecom infrastructure systems? Learn how to cool the systems that support 5G/high speed connections for reliable connectivity.

• Learn how acoustic imaging and testing can help you avoid failures in control modules and high-voltage IGBTs.

• Does your high power application demand liquid or forced air cooling? Learn how chillers and fans can transfer heat away from your components and increase thermal stability.  

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Professionals in the automotive, semiconductor, aviation, aerospace, lighting, power, electronics and other industries depend on 24/7 reliability in their devices, in all conditions.  Attend to learn how you can eliminate hear related product and component failures in your systems at this unique and interactive thermal management conference.

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Digital Conference Benefits

The virtual conference will feature live-streamed video presentations and Q&A sessions with thought-leaders, and presentations will be available on-demand after the event. This event will offer the best networking of any virtual conference with pre-scheduled 1x1 meetings in private video conferences, and an open exchanges of ideas in our Group Chat lobby.  Meet and learn from exhibitors, just like you would onsite, with our virtual booths and private chat rooms.

Register Now

Early Bird Pass: On or Before June 18th - $295

Full Rate Pass: After June 18th - $495