Advancements in
Thermal Management

CANCELED

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The 2022 Advancements in Thermal Management Conference taking place in Denver CO on August 3-4 has been canceled. We value your team's support and look forward to future programs. Please reach out to Robert Schaudt with any questions. 

The Advancements in Thermal Management Conference is back, in-person, in Denver. If you are a designer of a product or system that needs to mitigate heat, this is the conference for you. Attend to learn about the latest Thermal Management Technologies for Electronics Packaging. 

For more than a decade professionals in the automotive, semiconductor, aviation, aerospace, lighting, power, electronics and other industries have been coming to conference to learn about the latest developments in the market.  Attend to learn how you can eliminate hear related product and component failures in your systems at this unique and interactive thermal management conference.

  • Do you work in Electronics Product Design? Learn about advances in thermal materials, thermal design and simulation, and heat transfer in electronics packaging. 

  • Are you designing telecom infrastructure systems? Learn how to cool the systems that support 5G/high speed connections for reliable connectivity.

  • Learn how acoustic imaging and testing can help you avoid failures in control modules and high-voltage IGBTs.

  • Does your high power application demand liquid or forced air cooling? Learn how chillers and fans can transfer heat away from your components and increase thermal stability.  

Hardware Technician
Who Should Attend
  • CTO/CEOs

  • Engineers/Technical Directors

  • Product Designers 

  • Application Engineers

  • System Engineers

  • Academia

  • Software Engineers

  • Thermal Scientists

  • Consultants

  • Sales and Marketing

  • Product Managers

Professionals Working with
  • Thermal Management

  • Characterization and Measurement for Thermal Materials

  • Electronics Cooling

  • Thermal Materials

  • Thermal Design and Modeling

  • Infrared

  • Thermography

  • Air and Liquid Cooling

  • Thermal Ground Planes

  • Research and Development

  • Thermistors, Thermocouples, Thermoelectrics and Insulation

  • Thermal Sensing and Measurement

  • Sensors and Instruments

  • Test Equipment

  • Thermal Control

  • Thermal Ground Planes

  • IC Level Thermal Management

Past Attendees

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